Kyungjin Kim

Assistant Professor

School of Mechanical, Aerospace, and Manufacturing Engineering

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Education

• Ph.D., Mechanical Engineering, Georgia Institute of Technology, 2018
• B.S., Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 2014

Research Interests

• Developing long-term functioning soft and deformable electronic devices using vacuum processed hermetic encapsulations and various quality control methods, ultimately to engineer the reliability of next-generation devices such as flexible and stretchable electronics, implantable bioelectronics both in the materials and device level.
• Smart packaging of food and pharma-, composite materials in aircraft/naval engineering, where optimizations and reliability analysis of nanocomposite materials, barrier materials, fatigue and fracture of materials are required, building interdisciplinary research towards microengineering, materials science, and biomedical engineering.

Publications

Kathe, C.,* Skinnider, M.,* Hutson, T.,* Regazzi, N., Gautier, M., Demesmaeker, R., Komi, S., Ceto, S., James, N., Cho, N., Baud, L., Galan, K., Matson, K., Rowald, A., Kim, K., Wang, R., Prior, J., Asboth, L., Barraud, Q., Lacour, S., Levine, A., Wagner, F., Bloch, J.,# Squair, J.,# Courtine, G.,# “The neurons that restore walking after paralysis,” Nature, 2022. (DOI: https://doi.org/10.1038/s41586-022-05385-7)

Mariello M, Kim, K, Wu, K, Lacour SP, Leterrier Y. “Recent advances in encapsulation of flexible bioelectronic implants: materials, technologies and characterization methods,” Advanced Materials. 2022. (DOI: https://doi.org/10.1002/adma.202201129)

Park, Y., Fernandez, C., Kim, K., Chou, W., Larrain, F., Graham, S., Pierron, O.N., Kippelen, B., “Skin-like lownoise elastomeric organic photodiodes,” Science Advances, 2021. (DOI: https://doi.org/10.1126/sciadv.abj6565)

Kim, K., Van Gompel, M., Wu, K., Schiavone, G., Carron, J., Bourgeois, F., Lacour, S., Leterrier, Y., “Extended barrier lifetime of partially cracked organic/inorganic multilayers for compliant implantable electronics,” Small, 17(40), p.2103039, 2021. (DOI: https://doi.org/10.1002/smll.202103039)

Kathe, C.,* Michoud, F.,* Schönle, P.,* Rowald, A., Brun, N., Ravier, J., Furfaro, I., Paggi, V., Kim, K., Soloukey, S., Asboth, L., Hutson, T.H., Jelescu, I., Philippides, A., Alwahab, N., Gandar, J., Huber, D., De Zeeuw, C.I., Barraud, Q., Huang, Q., Lacour, S.,# and Courtine, G.,# “Wireless closed-loop optogenetics across the entire dorsoventral spinal cord in ecological environments,” Nature Biotechnology, pp.1-11, 2021. (DOI: https://www.nature.com/articles/s41587-021-01019-x)

Kim, K., Jia, X., Fernandez, C., Kippelen, B., Graham, S., and Pierron, O.N., “Optimizing crack onset strain for Silicon Nitride / Fluoropolymer Nanolaminate Barrier Films,” ACS Applied Nano Materials, 2 (4), pp.2525-2532, 2019. (DOI: https://doi.org/10.1021/acsanm.9b00440)

Kim, K., Pierron, O.N., and Graham, S., “Atomic layer deposited Al2O3 capping layer effect on environmentally assisted cracking in SiNx barrier films, Journal of Applied Physics, 125(4), p.045301, 2019. (DOI: https://doi.org/10.1063/1.5061780)

Kim, K., Luo, H., Zhu, T., Pierron, O.N. and Graham, S., “Influence of polymer substrate damage on the time dependent cracking of SiNx barrier films,” Scientific Reports, 8(1), p.4560, 2018. (DOI: https://doi.org/10.1038/s41598-018-22105-2)

Kim, K., Graham, S. and Pierron, O.N., “Note: A single specimen channel crack growth technique applied to brittle thin films on polymer substrates,” Review of Scientific Instruments, 88(3), p.036102, 2017. (DOI: https://doi.org/10.1063/1.4977473)

Kim, K., Luo, H., Singh, A.K., Zhu, T., Graham, S. and Pierron, O.N., “Environmentally Assisted Cracking in Silicon Nitride Barrier Films on Poly (ethylene terephthalate) Substrates,” ACS applied materials & interfaces, 8(40), pp.27169-27178, 2016. (DOI: https://doi.org/10.1021/acsami.6b06417)